Osaka university

Application of Plasma Chemical Vaporization Machining for Figuring of Reaction-sintered Silicon Carbide

Ceramic,Machining,Silicon,Ultra-precision

Planarization of SiC and oxide surfaces by using Catalyst-Referred Etching with water

Removal of subsurface damage of 4H-SiC wafer by plasma assisted polishing

Study on oxidation processes of 4H-SiC (0001) for investigation of the atomically flattening mechanism in plasma assisted polishing

Polishing pad properties for achieving high edge surface flatness

A novel abrasive-free chemical planarization of oxide materials using pure water and Pt catalyst

Novel cutting tools having micro textured surface for steel cutting

Polishing characteristics of single crystal SiC assisted by plasma oxidation using different kinds of abrasives

Flatness correction of quartz glass substrate by plasma jet figuring with pulse width modulation control

A new mirror-like finish method for oxide materials by a catalytically induced chemical etching in pure water

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