Osaka university

|Osaka university

Polishing characteristics of CVD-SiC in plasma-assisted polishing

Flattening of single crystal SiC by combination of anodic oxidation and soft abrasive polishing

Stacking mirror device using millimeter-thick elliptical supermirrors fabricated by numerically controlled local wet etching for focusing neutron beam

Analysis of subsurface atomic structure of 4H-SiC processed by plasma assisted polishing

Microgrooving with Flat-ends for Hard Materials

Scanning measurement of step height and freeform surface by using optically trapped microsphere

DNA Autonomous Joint for Micro Self-assembly

High-integrity Finishing of Reaction Sintered SiC by Plasma Assisted Polishing Using Ceria Abrasive

Electrochemical mechanical polishing of difficult-to-machine mold materials

Highly-efficient slurryless finishing of GaN by plasma-assisted polishing using a resin bonded grinding stone

Translate »