Porous chuck without vacuum for wafer grinding and polishing
Grinding;Polishing;Wafer
Relationship between phase transformation pressure and shear stress in the machining of semiconductor crystals
Cutting;Diamond;Pressure;Single crystal
Analysis of effects of mechanical properties on ductile-to-brittle transitions at nano-scale mechanical machining
Hardness;Micromachining;Nano manufacturing
Monitoring and Prediction in centering process of optical glass lenses using LSTM with acoustic emission sensor
Acoustic;Grinding;Monitoring;Predictive
Validation of the cutting equation by accurate orthogonal cutting experiments
Cutting;In-process measurement;Measurement;Verification
Precision cutting of Ni-P plated large mold for X-ray mirror – The effect of tool positioning error on the workpiece form deviation
Cutting;Mold (or Mould);Precision;X-ray
Thermomechanical impact of the cutting edge microgeometry on the surface properties in turning of aluminium alloys
Aluminium;In-process measurement;Surface;Turning
CAD geometry preparation issues effecting FE simulation accuracy
Computer aided design (CAD);Design;Finite element method (FEM);Mechanical
Tool wear in drilling using cutting fluid diluted with alkaline aqueous solutions
Drilling;Fluid;Tool;Wear