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National Defense Academy Japan
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National Defense Academy Japan
Development of a freezing pin chuck for polishing to fabricate a nonwarped substrate: Fixing characteristics to polish a quartz glass wafer
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euspen
2018-04-04T13:58:56+00:00
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Fundamental characteristics of a water-film chuck
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euspen
2018-04-04T13:59:15+00:00
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Development of a freezing pin chuck for fabricating a nonwarped substarate:Peeling due to thermal stress during polishing and deformation during fixing
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euspen
2018-04-04T14:04:46+00:00
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New Slurry-flowback Mechanism Stabilizing Slurry Flow to Improve Removal Rate for CMP
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euspen
2018-04-04T14:04:51+00:00
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Grinding Performance of a Grain-Arranged Diamond
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euspen
2018-04-04T14:05:23+00:00
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