Simulation Design of Vibration Blade for Silicon Wafer Dicing System
Piezo-electric;Simulation;Ultrasonic;Vibration
Piezo-electric;Simulation;Ultrasonic;Vibration
Burr;Injection;Molding (or Moulding)
Bearing;Design;Evaluation;Experimentation
Bearing;In-process measurement;Model
Modelling;Ultra-precision
Biomedical;Design method;Haptic device;Modelling
Actuator;Handling;Vacuum;Wafer
Finite element method (FEM);Modelling;Nano indentation
Dynamic;Finite element method (FEM);Model;Vibration