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Hannover 2017
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Hannover 2017
How to qualify wafer thermal conditioning at milli-Kelvin resolution?
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euspen
2018-04-04T13:57:30+00:00
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Recent results of micro geometry measurements using Werth 3D Fibre Probe
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euspen
2018-04-04T13:57:31+00:00
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Observation of phenomenon in gap area during hole drilling with micro EDM
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euspen
2018-04-04T13:57:31+00:00
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Demands for nanoradian angle metrology and performance requirements on autocollimators
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euspen
2018-04-04T13:57:33+00:00
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Removal of subsurface damage of 4H-SiC wafer by plasma assisted polishing
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euspen
2018-04-04T13:57:33+00:00
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Addressing Source-Induced Structural Vibrations in an Interventional X-ray Device
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euspen
2018-04-04T13:57:33+00:00
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Influence of dielectric fluid and tool electrode choice on micro-EDMed nitinol surface integrity
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euspen
2018-04-04T13:57:33+00:00
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Monitoring of the thermal deformations on polymer parts using a vision system
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euspen
2018-04-04T13:57:34+00:00
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A mathematical explanation for the grinding marks in cross and parallel grinding
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euspen
2018-04-04T13:57:34+00:00
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Simulation of surface morphology and roughness during helical milling operation
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euspen
2018-04-04T13:57:34+00:00
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