The Hong Kong Polytechnic University

|The Hong Kong Polytechnic University

Image-processing-based Analysis of Subsurface Damage in Diamond Wire Sawing of Silicon Wafer

Cutting,Damage,Image,Surface

Magnetic field assisted batch nano-polishing of optical glass

Abrasion,Finishing,Machining,Polishing

Magnetic field-assisted batch polishing of freeform surfaces

Abrasion,Finishing,Polishing,Ultra-precision

Magnetic field-assisted batch polishing of freeform surfaces

Abrasion,Finishing,Polishing,Ultra-precision

A study of influence factors on form error and surface finish in the high-frequency ultrasonic vibration-assisted cutting of structured surfaces

Accuracy,Analysis,Manufacturing (CAM),Cutting

An investigation of maskless fluid jet polishing of three dimensional structured surfaces

Finishing,Microstructure,Mold (or Mould),Polishing

A study of magnetic field-assisted mass polishing of additive manufactured surfaces

Geometry,Polishing,Surface,Ultra-precision

Effects of process parameters on the replica shape in glass hot embossing

Glass,Hot stamping,Manufacturing,Precision

An investigation of factors affecting surface generation in ultrasonic vibration assisted diamond cutting of hard-brittle materials

Machining,Surface,Ultra-precision,Ultrasonic

An Investigation of Material Removal Characteristics and Surface Generation in Multi-jet Polishing of Inner Surfaces

Material,Polishing,Precision,Surface

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