Project Description

  Special Interest Group Meeting: Advancing Precision in Additive Manufacturing 
19th – 21st September 2023

Abstract Submission

Advancing Precision in Additive Manufacturing
19th – 21st September 2023, KU Leuven, Belgium

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Abstract Submissions
Fees
Keynote & SOTAs
Exhibitor Information
Venue, Travel & Social
Tutorial

This 10th in the series of joint Special Interest Group meeting between euspen and ASPE on Advancing Precision in Additive Manufacturing is crucial to putting Additive Manufacturing onto the factory floor. We are seeking papers in the following categories:

1.  Dimensional accuracy and surface finish in additive manufacturing (AM)

  • State of the art: What level of precision and technological development is achievable?
  • Functional specifications for form and finish
  • Prediction and modelling of dimensional errors and surface topography
  • Developments in fabricating lattice structures with high integrity
  • Diversity in scale of features: large-scale to micro-/nano-scale

2.  Design for precision

  • Design rules and tolerancing for AM
  • Topology optimisation/generative design in the context of AM and achieving precision
  • Novel designs for flexures and kinematic couplings for precision movement
  • Metallurgy and fatigue issues in high-cycle precision applications
  • Design and tolerancing of lattice structures

3.  Machine precision – process development and control

  • In-situ process monitoring, e.g. melt zone temperature, powder bed quality
  • In-process measurement of workpiece shape and topography
  • Using artefacts to assess machine performance, round-robin testing
  • Holistic views of the control system, process feedback, correction
  • Machine learning to conquer the complex AM parameter space
  • Machine learning with a focus on precision and uncertainty

4.  Standards certification and training

  • Certifying AM equipment capabilities and material properties
  • Industrial demands for ASTM and ISO standards

5.  Integrating AM into a holistic manufacturing process

  • Cost-benefit trade-offs of using AM within a complex process chain
  • Engineered partnerships among AM, secondary finishing and/or in-line metrology
  • Kinematic tooling or build-plate engineering
  • Digitalisation of manufacturing

6.  Metrology

  • Surface topography measurements on rough as-built surfaces
  • Dimensional metrology of internal features using computed tomography
  • Multi-sensor approaches, data fusion and machine learning
  • Complex form measurement, registration and fitting of point clouds
  • Measurement of 3D lattice strut dimensional accuracy and integrity
  • Characterisation of internal defects and voids

7.  Simulation

  • Prediction and accounting for distortion and topography
  • Physical model driven parameter optimisation and defect avoidance
  • Model validation: experimental requirements and datasets

The local hosts and organising committee for the joint Special Interest Group meeting between euspen and ASPE on Advancing Precision in Additive Manufacturing are :- Dr Paul Bills from University of Huddersfield, UK; Prof. Liam Blunt from University of Huddersfield, UK; Prof. Mathieu Brochu from McGill Institute for Advanced Materials, CA; Dr David Bue Pedersen from Technical University of Denmark, DK; Prof. Wim Dewulf from KU Leuven, BE; Jason Fox from National Institute of Standards and Technology, US; Dr John Taylor from University of North Carolina at Charlotte, US and Prof. Bey Vrancken from KU Leuven, BE.

The Additive Manufacturing meeting chairs are Prof. Liam Blunt from the University of Huddersfield and Dr John Taylor from the University of North Carolina at Charlotte.

This event is supported by our local host:

Key Dates

21st April 2023 : Online short abstract submission deadline

16th June 2023 : Online extended abstract submission deadline

7th July 2023 : Notification of presentation acceptance (oral/poster)

7th July 2023 : Delegate registration opens

Registration Fees

  • €195+VAT – euspen Student Member*
  • €450+VAT – euspen Member
  • €550+VAT – Non-euspen Member
  • €650+VAT – Exhibitor
  • €55+VAT  – Tutorial (Half Day)
  • 45+ VAT – Student Networking Dinner
  • €3– Printed Proceedings

*Student members fee is not inclusive of the networking dinner.

All speakers and presenters must register for the conference using the appropriate delegate fee.

Exhibitor Information

If you would like to exhibit at this meeting, your registration fee would include:

  • 1 x table (actual size to be confirmed)
  • 2 x chairs
  • Space for 2 roll-up banners
  • 5 minute industry presentation within the programme.  We would request this is not a sales pitch but more related to organisational information and real-life applications of products etc.
  • 1 x delegate registration (includes the networking dinner and access to presentations)

Submit an abstract for Additive Manufacturing 2023

Submit Abstract
Short Abstract Template
Extended Abstract Template
Abstract Guidelines

Announcement & Call for Abstracts

Come and join your international peers and maintain a leading edge on technology, customers, partners and suppliers. Access the greatest minds in Advancing Precision for Additive Manufacturing  research and development. Share knowledge and information and stimulate debates.

Themes :-

  • Dimensional accuracy and surface finish in additive manufacturing (AM)
  • Design for precision
  • Machine precision – process development and control
  • Standards certification and training
  • Integrating AM into a holistic manufacturing process
  • Metrology
  • Simulation

Submission of abstracts

Abstracts are expected to describe original work, previously unpublished and should indicate new and significant advances and their importance. Initially short abstracts between of around 300 words in length should be submitted online using the below links.

Following review of short abstracts, authors will be provided with instructions for submitting extended abstracts of either two or four A4 pages. On acceptance of extended abstracts, authors are notified of presentation mode (poster/oral). All papers accepted will also be indexed on to euspen’s Knowledge Base which is indexed via Scopus. The final decision on acceptance of all papers is made by the Editor and Scientific Committee of the SIG meeting.

The invitation to submit an abstract does not constitute an offer to pay travel, accommodation or registration costs associated with the conference. Similarly, no speaker fee is paid to successful participants. All speakers must register for the conference and transfer registration fee. In specific cases the organising committee reserves the right to deviate from the standard procedure.

Keynotes

Niels Holmstock

3D Systems, BE

Manufacturing precision parts with complex geometries using metal LPBF

Making precision components efficiently requires control of the entire manufacturing flow of a part. This presentation gives insight into challenges and best practices when aiming to make precision parts in a reproducible way. Multiple steps in the production process will be covered, including Part Design, Additive Manufacturing, Heat Treatment, Manual Finishing, CNC Machining and Quality Control. Examples used are sourced mainly from the semiconductor industry where high precision meets large quantities.

Biography

Niels Holmstock is a mechanical engineer working as Application Development manager for 3D Systems on metal additive manufacturing (AM) applications in their Application Innovation Group (AIG).

Over 7 years of working on complex metal AM projects for the semiconductor industry has taught him how to have both technical and economic success with making complex precision parts. Niels leverages this knowledge daily to accelerate metal AM away from prototyping only and towards a sustainable production technology.

Dr Ian Laidler

Wayland Additive, UK

Neubeam Electron Beam PBF and the advantages of active charge neutralisation

This talk will introduce the concepts of active charge neutralisation and then explore the benefits this brings to the electron beam powder bed fusion process.

Biography

Dr Ian Laidler is a Physicist and Engineer with more than 30 years of industrial experience directing complex technical developments of high value capital equipment for the semiconductor and medical industries. Ian has always worked with particle accelerators of some form ranging from superconducting electron synchrotrons for the X-ray lithography programmes of the ‘90s; superconducting proton cyclotrons for PET scanners; X-ray beamlines for the world’s third generation synchrotrons; and electron beam lithography systems for the semiconductor and nanotechnology industries.  As a co-founder of Wayland Additive, Ian has brought this experience to the field of electron beam metal AM.

State-of-the-Art

Assoc. Prof. Matthijs Langelaar

Delft University of Technology, NL

Topology Optimization for Additive Manufacturing – Focus on Precision

The past decade has seen rapid advances in both Additive Manufacturing (AM) technologies and computational design methods for AM, most notably Topology Optimization (TO). The design freedom offered by AM and the systematic form-follows-function process of TO form a synergetic combination that enables the generation of designs with unprecedented performance. In this contribution, next to a general introduction to TO-for-AM, recent developments in this field are considered, with special attention to various aspects of precision. This includes design resolution, distortion reduction, AM-enabled precision positioning applications, and also precision regarding material properties of printed parts.

Biography

Matthijs Langelaar is Associate Professor at Delft University of Technology, leading the Computational Design and Mechanics research group. The focus of his research is to advance computational design techniques in particular for demanding high-tech applications, with a specific emphasis on topology optimization and design for (additive) manufacturing.

He holds a PhD degree from Delft University of Technology and an MSc degree in Mechanical Engineering from University of Twente. He has also worked at the German Aerospace Center, University of Freiburg in Germany, University of Colorado at Boulder, US, and at Seoul National University, Korea.

Dr Ho Yeung

National Institute of Standards and Technology, US

Voxel level laser control for the laser powder bed fusion process

The laser powder bed fusion (LPBF) process is a widely utilized metal additive manufacturing (AM) technique, known for its capability to generate complex structures, optimized geometries, lightweight components, and intricate designs. Although AM is commonly perceived as a layer-by-layer method, LPBF actually builds parts voxel-by-voxel using a point laser heating source. Consequently, managing the LPBF process at the voxel level—emphasizing each three-dimensional printing element—yields significant benefits. This research presents a novel voxel-level laser control approach, utilizing time-stepped digital commands to coordinate laser power and diameter for each point along the digitally interpolated scan path. This method facilitates model-based scan strategy execution and digital twin-based real-time process control, while providing a clear description of the laser scan strategy, ensuring platform independence. An open-platform testbed, designed around the time-stepped digital command approach, is introduced, and case studies demonstrating various advanced scan strategies employing voxel-level laser control are explored.

Biography

Dr Ho Yeung is an Electronics Engineer at the National Institute of Standards and Technology (NIST).  His research career began with large plastic deformation, and machine tool control before transitioning to additive manufacturing in recent years. He leads the Machine and Process Control Methods for Additive Manufacturing project at NIST, and developed the AM control system for NIST Additive Manufacturing Metrology Testbed (AMMT). Ho Yeung holds a Ph.D. in Industrial Engineering from Purdue University, where he also earned both his MS and BS in Computer and Electrical Engineering.

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