Project Description

  Special Interest Conference Meeting: Advancing Precision in Additive Manufacturing 
6th – 9th October 2025

Abstract Submission

Advancing Precision in Additive Manufacturing
6th – 9th October 2025, TU Berlin, Germany

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The 11th in the series of joint Special Interest Conference meeting between euspen and ASPE on Advancing Precision in Additive Manufacturing is crucial to putting Additive Manufacturing onto the factory floor. We are seeking papers in the following categories:

1.  Dimensional accuracy and surface finish in additive manufacturing (AM)

  • State of the art: What level of precision and technological development is achievable?
  • Functional specifications for form and finish
  • Prediction and modelling of dimensional errors and surface topography
  • Applications ranging from large-scale to micro-nano

2. Metrology

  • Challenges in form, texture, and internal feature metrology of rough as-built AM components
  • Computed tomography for defect detection, dimensional metrology, internal geometries
  • Multi-sensor approaches, data fusion, and machine learning
  • Measurement, registration, and fitting of point clouds for freeform surfaces
  • Development of instruments, artifacts, and data processing tools to establish traceability across ex- and in-situ metrology systems (e.g., dimensional, thermal, etc.)

3. Design for manufacturing and precision applications

  • Design rules and tolerancing for AM
  • Topology optimization in the context of AM and achieving precision
  • Novel designs for flexures and kinematic couplings
  • Metallurgy and fatigue issues in high-cycle precision applications
  • Design, tolerancing, manufacture, and metrology of lattice structures

4. AM machines and process control

  • Holistic views of the control system, process feedback, and correction
  • Novel AM machine designs and control strategies
  • In-process monitoring: melt pool, powder bed, workpiece shape and topography
  • Artifacts to assess machine performance and errors; round-robin testing
  • Fundamental machine metrology to assess machine performance and errors

5. Integrating AM into a holistic manufacturing process

  • Cost-benefit trade-offs of using AM within a complex process chain
  • Engineered partnerships between AM and secondary finishing
  • Fixturing, machining, and metrology of near-net shape parts
  • Deterministic methods for qualification of AM processes, feedstocks, and parts
  • Functional correlations for the development of standards that support industry
  • Achieving precision with a focus on sustainability

6. Process physics, simulation, and optimization

  • Prediction and modeling of distortion and topography
  • Parameter optimization and defect avoidance
  • Model validation: experimental requirements and datasets
  • Machine learning and AI

The local hosts and organising committee for the joint Special Interest Group meeting between euspen and ASPE on Advancing Precision in Additive Manufacturing are :-  Prof. Liam Blunt from University of Huddersfield, UK;  Prof. Wim Dewulf from KU Leuven, BE; Jason Fox from National Institute of Standards and Technology, US; Prof. John Taylor from University of North Carolina at Charlotte, US; Prof. Jaime Berez from The University of North Carolina at Charlotte, US; Dr. Mitchel Polte from TU Berlin, DE; Prof. Julian Polte from TU Berlin, DE; Prof. Dirk Oberschmidt from TU Berlin, DE; Prof. Christian Haase from TU Berlin, DE; Prof. Kai Hilgenberg from TU Berlin, DE and Prof. Michael Rethmeier from TU Berlin, DE.                  

The Additive Manufacturing meeting chairs are Prof. Liam Blunt from the University of Huddersfield and Dr John Taylor from the University of North Carolina at Charlotte.

This event is supported by our local host:

Key Dates

25th April 2025 : Online short abstract submission deadline

20th June 2025 : Online extended abstract submission deadline

11th July 2025 : Notification of presentation acceptance (oral/poster)

11th July 2025 : Delegate registration opens

Registration Fees

  • €195+VAT – euspen Student Member*
  • €450+VAT – euspen Member
  • €550+VAT – Non-euspen Member
  • €650+VAT – Exhibitor
  • 45+ VAT – Student Networking Dinner
  • €3– Printed Proceedings

*Student members fee is not inclusive of the networking dinner.

All speakers and presenters must register for the conference using the appropriate delegate fee.

Registration 

The euspen SIC meeting on Additive Manufacturing complies with international VAT/IVA/VAT MOSS regulations. The standard German VAT rate of 19% will be applied to all delegate registration invoices. Please select the appropriate payment option below.

Select Credit Card if you would like to pay by credit card :-

Select Invoice if you would like to pay by invoice :-

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Invoice
  1.  A valid Purchase Order (PO) number is required to guarantee payment.
  2.  An administration fee of €30 will be applied.
  3.  All invoices must be settled prior to attendance of the event. If the invoice remains outstanding at the point of attendance,   the delegate will be required to pay the invoice via credit card before admittance.
  4. Your completed form should be sent to info@euspen.eu and an invoice will be sent to you manually.

Exhibitor Information

If you would like to exhibit at this meeting, your registration fee would include:

  • 1 x table (actual size to be confirmed)
  • 2 x chairs
  • Space for 2 roll-up banners
  • 5 minute industry presentation within the programme.  We would request this is not a sales pitch but more related to organisational information and real-life applications of products etc.
  • 1 x delegate registration (includes the networking dinner and access to presentations)

Sponsors

Exhibitors

Submit an abstract for Additive Manufacturing 2025

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Short Abstract Template
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Abstract Guidelines

Announcement & Call for Abstracts

Come and join your international peers and maintain a leading edge on technology, customers, partners and suppliers. Access the greatest minds in Advancing Precision for Additive Manufacturing  research and development. Share knowledge and information and stimulate debates.

Themes :-

  • Dimensional accuracy and surface finish in AM
  • Metrology
  • Design for manufacturing and precision applications
  • AM machines and process control
  • Integrating AM into a holistic manufacturing process
  • Process physics, simulation, and optimization

Submission of abstracts

Abstracts are expected to describe original work, previously unpublished and should indicate new and significant advances and their importance. Initially short abstracts between of around 300 words in length should be submitted online using the below links.

Following review of short abstracts, authors will be provided with instructions for submitting extended abstracts of either two or four A4 pages. On acceptance of extended abstracts, authors are notified of presentation mode (poster/oral). All papers accepted will also be indexed on to euspen’s Knowledge Base which is indexed via Scopus. The final decision on acceptance of all papers is made by the Editor and Scientific Committee of the SIC meeting.

The invitation to submit an abstract does not constitute an offer to pay travel, accommodation or registration costs associated with the conference. Similarly, no speaker fee is paid to successful participants. All speakers must register for the conference and transfer registration fee. In specific cases the organising committee reserves the right to deviate from the standard procedure.

 Keynotes & SOTA’s

SOTA:  David C. Deisenroth

Mechanical Engineer at National Institute of Standards and Technology (NIST, USA)

Calibrations and Experimental Results from Laser-Based Metal Additive Manufacturing Testbeds at NIST

This presentation will describe measurement methods and results from the United States National Institute of Standards and Technology (NIST) laser-based metal additive manufacturing (AM-LB/M) testbeds. There will be particular focus on accurate calibration of the testbeds’ performance. Approaches for calibrating laser power, power density distribution, scan speed, turnaround time, positioning accuracy, and more, will be discussed. After that, the results of some of NIST’s most unique measurement capabilities that pertain to AM-LB/M will be exhibited.

David Deisenroth is a Mechanical Engineer at the National Institute of Standards and Technology (NIST). David joined NIST as a National Academy of Sciences/National Research Council Post-Doctoral Fellow in 2018. As the founder of the Fundamentals of Laser-Matter Interaction (FLaMI) Testbed, his research focuses on developing optical metrology for accurately quantifying laser-matter interaction physics, as well as for characterizing laser-based additive manufacturing machine performance. The measurands of particular interest include directionally resolved reflected laser power, applied laser power density distributions, and optical properties of the process byproduct plume and ejecta. David has delivered a half-dozen invited presentations on these topics across North America and Europe since 2021.

Keynote: Dr.-Ing. Tina Schlingmann    

Regional Director EMEA at EOS GmbH

Tina Schlingmann is a materials scientist with a PhD and an experienced additive manufacturing strategist, who is passionate about the potential and new opportunities that can be leveraged through additive manufacturing (AM) technology.

Since May 2021, she has been working as Regional Director EMEA at EOS GmbH. In her current role she is responsible for the DACH and Benelux regions, focusing on the further development of the AM market. With a very application-oriented focus, she creates end-to-end solutions and accelerates the growth of the AM market by bringing together AM-designed materials with the appropriate applications.

If you are interested in finding out more you can find me as a guest in the following podcasts:
• Heldengeschichten – Printing the future! Die neusten 3D-Druck Trends bei EOS.
• Druckwelle – Folge #66. Mehr Nachhaltigkeit durch neue Materialien und Technologien
• Feuer&Flamme – Folge #92. Vorurteile bekämpfen
• Permanent Change – Folge #69. Lächelreflex: schon mal dabei erwischt?
• Design Perspectives – Folge #3. Revolution im 3D-Druck

Keynote: Stefanie Brickwede    

Managing Director at MGA

As Managing Director, Stefanie Brickwede passionately set up the international leading network “Mobility goes Additive” with 150 member companies. 2019 a 2nd branch “Medical goes Additive“ was launched. Since 2015, she also heads 3D Printing at DB AG, responsible for the successful introduction of AM throughout the Group and realizing a million € potential yearly. After graduating as an economist at the TU Hanover, she started her career in the mobility sector and has since held various management positions at DB AG.

Keynote: Professor Ada-Ioana Bunea

Associate Professor at DTU Nanolab

Optimizing 3D and 4D printing by two-photon polymerization

Fabrication parameters play an important role in the resulting topological and mechanical properties of 3D printed polymer structures. In 4D printing, which is 3D printing with smart responsive materials, fabrication parameters play an even bigger role. Here, structure integrity needs to be balanced with the material response. This talk will describe the influence of various process parameters on two-photon polymerization-based 3D and 4D printing, as well as current relevant challenges and proposed solutions.

Ada-Ioana Bunea got her Ph.D. degree in Micro- and Nanotechnology from the Technical University of Denmark in 2018. Originally trained as a Chemist at the University of Bucharest, in Romania, her background is highly interdisciplinary, combining expertise in various fabrication, surface modification, and characterization techniques. Since 2018, her main focus has been within additive manufacturing, particularly the two-photon polymerization direct laser writing of both standard photoresists and smart materials. She is currently Associate Professor at the DTU Nanolab, where she leads the Polymer Microsystems (POLYMIC) research group and is Principal Investigator on two research projects focused on developing microrobots for biomedical applications.

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