Image-processing-based Analysis of Subsurface Damage in Diamond Wire Sawing of Silicon Wafer
Cutting,Damage,Image,Surface
Cutting,Damage,Image,Surface
Adaptive control,Artificial intelligence,Dynamic,Quality assurance
3D printing,Polymer,Surface,Texture
Design,Dynamic,Interferometry,Metrology
Artificial intelligence,Biomedical,Maintenance,Predictive
Control,Optimisation,Positioning,Ultra-precision
Electrical discharge machining (EDM),Mechanical,Micromachining,Ultra-precision
Electrical discharge machining (EDM)
Dressing,Manufacturing,Polishing