Porous chuck without vacuum for wafer grinding and polishing
Grinding;Polishing;Wafer
Grinding;Polishing;Wafer
Digital;Machining;Simulation
Actuator;Mechatronic;Piezo-electric;Positioning
Actuator;Design;Mechanism;Shape memory alloy
Machine;Sensor;Thermal error
Analysis;Classification;Interferometry;Metrology
Machining;Optical;Roughness;Temperature
Electro chemical machining (ECM);Micromachining
Forming;Glass;Laser micro machining;Sustainable development
Cutting;Mold (or Mould);Precision;X-ray