Fully compliant snap-through bistable gripper mechanism based on a pinned-pinned buckled beam
Design;Mechanism;Modelling;Nonlinear
Analysis of effects of mechanical properties on ductile-to-brittle transitions at nano-scale mechanical machining
Hardness;Micromachining;Nano manufacturing
High precision thermal control of fluidic mediums
Cooling;Machine;Temperature
Porous chuck without vacuum for wafer grinding and polishing
Grinding;Polishing;Wafer
Use of digital tools to simulate the accuracy of subtractive machining processes
Digital;Machining;Simulation
Relationship between phase transformation pressure and shear stress in the machining of semiconductor crystals
Cutting;Diamond;Pressure;Single crystal
Simulation Design of Vibration Blade for Silicon Wafer Dicing System
Piezo-electric;Simulation;Ultrasonic;Vibration
Micro deburring of high-precision injection moulded parts using thermal energy machining
Burr;Injection;Molding (or Moulding)