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Berlin 2013
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Berlin 2013
Silicon surface texturing by forming sub-micron bumps with a CW fiber laser
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euspen
2018-04-04T13:58:46+00:00
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Production technique for Au-Pt Buffer Layer for the High Piezoelectric PZT
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euspen
2018-04-04T13:58:46+00:00
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Design and Validation of a Pitch Tester
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euspen
2018-04-04T13:58:47+00:00
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Micro Prism Array Machining on Large Area of Brass Foil for Making Roller Imprinting Mould
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euspen
2018-04-04T13:58:47+00:00
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Precise Compensation of Component Distortion by an Adaptive Clamping System
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euspen
2018-04-04T13:58:47+00:00
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Design and Implementation of a High-Power Machining Facility for Investigations in Vortex Machining
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euspen
2018-04-04T13:58:48+00:00
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Quantifying the gap formed between the tool and the glass surface during SACE micro-drilling
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euspen
2018-04-04T13:58:48+00:00
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Influence on the ductile behaviour of binderless tungsten carbide applying ultrasonic assisted diamond turning
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euspen
2018-04-04T13:58:48+00:00
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An atomistic investigation of FIB process damage on diamond
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euspen
2018-04-04T13:58:48+00:00
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Grinding Processes for Silicon Carbide (CSiC) Materials
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2018-04-04T13:58:49+00:00
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