Atomically smooth Si surface planarized using a thin film catalyst in pure water
https://www.euspen.eu/wp-content/uploads/2020/05/Presentation_ICE20238_0510041132.mp4
P2.08 : Feasibility using ethanol-added argon instead of helium as the carrier gas used in atmospheric-pressure plasma chemical vaporization machining
https://www.euspen.eu/wp-content/uploads/2020/05/Presentation_ICE20245_0506045939.mp4