Yeungnam University

|Yeungnam University

Simulation Design of Vibration Blade for Silicon Wafer Dicing System

Piezo-electric;Simulation;Ultrasonic;Vibration

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Finite Element Study of Two-Dimensional Ultrasonic Vibration Assisted Cutting

Cutting,Finite element method (FEM),Force,Ultrasonic

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Experimental study of friction reduction of micro dimples on cylindrical surface

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Experimental study of micro-dimple surface roughness by applying double-frequency elliptical vibration texturing

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