Yeungnam University

Simulation Design of Vibration Blade for Silicon Wafer Dicing System

Piezo-electric;Simulation;Ultrasonic;Vibration

Clare Nisbet2024-06-07T15:43:37+00:00

Finite Element Study of Two-Dimensional Ultrasonic Vibration Assisted Cutting

Cutting,Finite element method (FEM),Force,Ultrasonic

Dishi Phillips2020-07-23T15:59:28+00:00

Experimental study of friction reduction of micro dimples on cylindrical surface

euspen2018-04-04T14:00:40+00:00

Experimental study of micro-dimple surface roughness by applying double-frequency elliptical vibration texturing

euspen2018-04-04T14:07:01+00:00

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