National Defense Academy

|National Defense Academy

Study on constant pressure machining of single crystal SiC with ruby spheres : Effect of machining speed

Ball;Ceramic;Machining;Silicon

Measurement of the grinding fluid distribution in the contact arc using scattered light: Effect of the table speed on grinding fluid distribution

Fluid;Grinding;Image;In-process measurement

Porous chuck without vacuum for wafer grinding and polishing

Grinding;Polishing;Wafer

Effect of grinding fluid on the grinding characteristics of CMSX4

Grinding,Turbine blade

Constant-pressure machining of single crystalline silicon carbide using a ruby sphere

Carbide,Machining,Silicon,Single crystal

Effect of grinding wheel safety guard thickness in the collision of a conical projectile

Grinding,Machine,Sheet metal,Steel

Study of CFRP grinding method with electrical discharge machining

Carbon,Electrical discharge machining (EDM),Grinding,Roughness

Best Method to Achieve High Total Tickness Variance and High Flatness in Double-sided Polishing

Lapping,Polishing,Profile,Simulation

Correction grinding of a wafer profile using freezing pin chuck

Grinding,Wafer

Study on the workpiece temperature in the side milling of CFRP

End milling,Temperature

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