Project Description

20th International Conference & Exhibition
8th – 12th June 2020, CERN, Geneva

Delegate Registration
Programme
Fees
Keydates
Keynotes
Exhibitor Zone
Scholarships
Submissions
Venue, Travel & Social
Tutorials
Workshops
Company Tours
Scientific Committee

Monday 8th June – Friday 12th June 2020
CERN
Starling Hotel & Conference Centre, Geneva, CH

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euspen’s international conference and exhibition provides a leading forum for industrialists and academics alike to review the best of world-wide industrial innovation, progressive research and technology developments. Delegates will gain an insight into the precision engineering and nanotechnology priorities of Europe’s leading industrial nation.

euspen’s international conference and exhibition provides a leading forum for industrialists and academics alike to review the best of world-wide industrial innovation, progressive research and technology developments. Delegates will gain an insight into the precision engineering and nanotechnology priorities of Europe’s leading industrial nation.

The organising commitee and local hosts for euspen‘s 20th International Conference and Exhibition is Prof. Enrico Savio, University of Padova, IT; Dr Hélène Mainaud Durand, CERN, CH and Dr Harald Bosse from PTB, DE

Themes and Call for Abstracts:

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Submission Authors
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Submission Countries
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Submitting Organisations
Data from 2019

Announcement & Call for Abstracts

Come and join your international peers and maintain a leading edge on technology, customers, partners and suppliers. Access the greatest minds in micro and nano research and development. Share knowledge and information and stimulate debates.

Themes

• Measuring Instruments and Machine Tools: Design and Performance
• Mechatronics, Control, Handling
• Metrology
• Advances in Precision Engineering and Nanotechnologies
• Mechanical Manufacturing Processes
• Non-Mechanical Manufacturing Processes
• Replication and Additive Manufacturing
• Applications of Precision Engineering in Biomedical Sciences
• Automation, Robotics, Machine Learning
• Large Scale Precision Engineering: Design, Metrology & Applications

Submission of abstracts

Abstracts are expected to describe original work, previously unpublished and should indicate new and significant advances and their importance. Initially short abstracts comprising of approximately 300 words in length should be submitted online using the below links.

Following review of short abstracts, authors will be provided with instructions for submitting extended abstracts of up to four A4 pages. On acceptance of extended abstracts, authors are notified of presentation mode (poster/oral). All papers accepted into the conference proceedings are included in Elsevier’s citation index and will also be indexed on to euspen’s Knowledge Base which is indexed via Google Scholar. The final decision on acceptance of all papers is made by the Editor and International Scientific Committee of the conference.

The invitation to submit an abstract does not constitute an offer to pay travel, accommodation or registration costs associated with the conference. Similarly, no speaker fee is paid to successful participants. All speakers must register for the conference and transfer registration fee. In specific cases the organising committee reserves the right to deviate from the standard procedure.

Submit Abstract
Short Abstract Template
Agreement
Style Guide
Extended Abstract Template

“Oral and poster sessions revealing the latest research and state-of-the-art technology”

Key Dates:

30th September 2019: Deadline for online short abstract submissions

30th December 2019: Deadline for online extended abstract submissions

30th December 2019: Deadline for Scholarship Applications

9th March 2020: Notification of extended abstract award (oral/poster) 

9th March 2020: Notification of Scholarship award 

Conference Fees:

The conference delegate registration fee includes :-

  • Free access to the welcome reception to be held on the Monday evening of 8th June 2020
  • A full electronic copy of the proceedings on a euspen USB drive
  • Free access to the technical workshops held on Monday afternoon of 8th June 2020
  •         Free refreshments through-out the conference
  •         Free three course Lunch on each of the conference days
  • Student delegates have an opportunity to attend the student networking dinner Free of Charge on 9th June 2020
  • Access to all of the keynote and technical presentations held through-out the conference
  • Access to the euspen conference App which allows for easy networking with fellow delegates
  • Access to the exhibitors drinks reception held on Tuesday 9th June 2020
  • €795 – euspen Members Early Bird
  • €860 – euspen Members Standard
  • €895 – Non Members Early Bird
  • €960 – Non Members Standard
  • €475 – Student Members Early Bird
  • €540 – Student Members Standard
  • €95 – Evening Networking Dinner
  • €50 – Printed Conference Proceedings
  • *€195 – Tutorial – Half Day

  • *€245 – Tutorial – Full Day

*Costs are for conference delegates

  • *Delegate Workshops – Free of Charge
  • €50 – Company Tour

Our Early Bird fees are valid until 5th April 2020

The Precision Engineering community is quite small and the euspen annual event is a great way to make and maintain contact with world-leading experts in the field, many of whom offer highly relevant tutorial sessions at the conferences. We at Cranfield Precision specialise in the design and manufacture of high precision machine systems, it would be unthinkable for us not to take advantage of the technical program, networking and educational opportunities on offer at euspen conferences. Since around 2011, we have been exhibitors at the annual conference exhibition, we have found this to be an excellent way of making contact with new and existing customers. We can trace the initial contact made with many of our current and past customers back to the euspen conference and exhibition, so the cost of attending and exhibiting has paid for itself many times over.
Mark Stocker, Cranfield Precision
With over 400 attendees focused on precision engineering, exhibiting at the Annual Conference & exhibition organised by euspen is vital to getting our message to the right people. The ultimate benefit to attending is the people you meet. Networking with industry experts willing to discuss ideas and offer suggestions to those difficult projects waiting for you back home. These conversations lead to treasured relationships with talented precision engineers you can consult when difficult questions arise.
Byron Knapp, Professional Instruments

Conference Sponsors:

Conference Proceedings 

Renishaw will be sponsoring the conference proceedings for the 20th International Conference.

Student Scholarships

Scholarships supported by Heidenhain GmbH are available for students or researchers registered at a recognised International Higher Education Institution.  Deadline date to receive applications is Monday 30th December 2019.

Exhibitor Drinks

IOP Publishing will be sponsoring the exhibitor drinks.

Welcome Reception Sponsors

Welcome reception will be held on the evening of Monday 8th June 2020.

Conference Keynotes:

Dr. Begoña Vila

Systems Engineer, NASA GSFC/SGT, US

The James Webb Space Telescope: Testing on the ground to ensure on-orbit performance

The James Webb Space Telescope is the largest, most complex telescope being launched to date. It includes segmented folded mirrors and a folded sunshield deploying on orbit, and instruments with state of the art infrared detectors and different science capabilities operating below 45K (-378 F). A rigorous test campaign including ambient and cryogenic tests to verify the health, performance and operations readiness in the conditions it will see on orbit is near its completion.

A summary of some of those tests and their challenges as all the observatory components were assembled will be presented, covering in particular the comprehensive program of thermal, optical, electrical and operational tests in the cryogenic chambers at Goddard Space Flight Center and Johnson Space Center and final ambient tests at Northrop Grumman. How the telescope achieves the pointing stability required for science operations by using the various components of its Fine Guidance System, the alignment of the telescope mirrors and observation innovations on the science instruments will be covered.

Dr. Begoña Vila is the lead Systems Engineer at NASA’s Goddard Space Flight Center/SGT for two of the instruments on the James Webb Space Telescope (JWST), one of them the Fine Guidance Sensor responsible for the pointing and stability of the Observatory. She obtained her PhD in Astrophysics at Jodrell Bank, Manchester University, UK after her undergraduate degree in Spain. Her research included rotation curves of galaxies, nuclear galactic activity and stellar abundances observing both in optical and in radio wavelengths. She has been involved with JWST since 2006 starting in Canada under the Canadian Space Agency and moving to NASA after the flight instruments were delivered in 2012. She was the overall test lead for the final cryogenic test at Goddard for all the JWST instruments and was heavily involved in the testing completed at the Johnson Space Center cryogenic chamber that included the JWST instruments and mirrors. She is currently working the test planning at the Observatory level at NGAS, and the detailed plans for commissioning and operating the instruments following the launch in 2021.

She has received various achievement awards including the NASA Exceptional Public Achievement Medal in 2016 and the Premio Wonenburger by the Xunta de Galicia (Spain) in 2017.

Apart from her work, Dr. Begoña Vila enjoys outreach activities communicating with the general public on JWST, STEAM or other, both in English and in Spanish.

Prof. Darwin Caldwell

Italian Institute of Technology (IIT), IT

The use of humanoids and AI in the industrial processes and manufacturing

Dr. Roberto Losito

CERN, CH

Present and Future CERN Projects and associated Engineering challenges

CERN complex of accelerators delivers beams of charged particles to a variety of Experiments. The flagship programme is around the Large Hadron Collider, a 27 km long accelerator in which beams of proton or heavy ions are brought into collision inside large detectors to investigate the microscopic nature of matter. The energy stored in the LHC beams can be as high as 360 MJ, therefore any misalignment or instability of the beams can result in heavy damage for the accelerator components.

This talk will discuss some of the engineering solutions implemented to avoid the impact on the beams with the beam pipes, and the challenges of providing protection for the accelerator components in such a geographically extended system. I will also give an overview of the future projects under discussion in the framework of the Update of the European Strategy for Particle Physics and highlight some of the main associated engineering challenges.

Roberto Losito was born in Naples, Italy. He received the M.Sc. degree in electronic engineering from the University of Naples “Federico II,” in 1992. He was a EU fellow with the Laboratoire de l’Accélérateur Linéaire, Orsay, France, and with the Institute of Research for Electromagnetics and Electronic Components, National Research Council, Naples, in 1994. Since 1995, he has been a fellow then a Staff Member with the European Organization for Nuclear Research, Geneva, Switzerland. He was involved in the design and construction of radio frequency systems for the Large Hadron Collider (LHC) for both normal conducting and superconducting systems. Then, he led a group in charge of the design, construction and operation of components of the accelerators interacting with particle beams, such as targets, collimators, dumps. He developed with his team the real time control system that allows to position within micrometers with respect to the orbit of the LHC beams the collimation system, which is geographically distributed over the 27 km long LHC tunnel. His group led the Radiation to Electronics Project at CERN, aiming at designing all controls electronics  exposed to radiation in the LHC tunnel, and has launched a initiative for robotics intervention in hazardous areas. Since 2016 he is the head of the Engineering Department at CERN.

Dr. Thomas Sesselmann

Johannes Heidenhain GmbH, DE

Geneva´s Special Contribution to Precision Manufacturing and Metrology in Europe: A Historical Perspective

Interchangeability of parts with utmost dimensional accuracy, no matter where they were manufactured, has been the most important condition of industrial mass production – first of weapons and later of high-quality consumer goods. Europe´s developing industries of the 1860s had been suffering from the inadequacy of the various existing length standards of the time. They laid all their hope in the advances brought forward by the International Meter Convention of 1875 which agreed on a new Meter Standard to be made of a platinum alloy. It was, however, so difficult to manufacture that it took until 1887 to produce the 30 sets of prototypes for each participating country of the Meter Convention.

Industry could not wait that long. Therefore, it was a breakthrough for the manufacturing community that a Geneva enterprise, the Société Genevoise d´Instruments de Physique (SIP), managed to build the replicas of the length standard earlier than the standard itself was completed, and even in far higher numbers and from a far more sophisticated material, INVAR. Only in this way was it possible to narrow manufacturing tolerances down to a range enabling mass production of goods using automated processes.

SIP continued to dominate the world of European Precision Manufacturing for the decades to come. In 1928, SIP was the pioneer to mount length standards for position feedback as integral parts into machine tools. Hence, SIP jig boring machines have laid the foundation for the closed-loop machine tools of the highest accuracy which can be achieved in our days.

Indeed, it is the Geneva of the late 19th and early 20th centuries which brought forth the high-degree of mechanical accuracy on which our modern-day products in the fields of mechanics, optics, electronics and many of the bioscience products of the future depend. As EUSPEN is meeting in Geneva this year to visit CERN, it might well be worthwhile to remind Europe´s modern-day precision manufacturing community of Europe of its local roots.

Thomas Sesselmann, Dr. rer. nat., Dipl.-Phys.

  • Spokesman of the Executive Board of DIADUR SE, the shareholding entity of JOHANNES HEIDENHAIN GmbH and MD ELEKTRONIK GmbH
  • Chairman of the Supervisory Boards of HEIDENHAIN and MD

Born:               1960

Education        Physics

PhD (1988):    Spectroscopic Examination of Interaction Potentials in dye-doped Polymer Matrices
(pressure effects on high-resolution hole-burning spectroscopy)

HEIDENHAIN

Since 1988      Responsible for various tasks and subsidiaries
Since 1995      Managing Director
Since 2003      Chairman of the Management Board
Dec. 2018        Retired from active HEIDENHAIN duty after 31 years, 24 years thereof as a Managing Director

EUSPEN

Since 1996      Involved in the founding process of EUSPEN
1999                One of the founding members
Until 2005       Council Member

PTB – the German Standard Laboratory

Since 2000      Member of the Advisory Board

Confirmed Exhibitors